…. the news from Rick Cassidy, president of TSMC in the U.S., reported by Bloomberg, that the company’s Pheonix fab delivered 4 percent better yield on advanced chips than fab sites in Taiwan is impressive. In chip industry parlance, yield ….
TSMC Joint Venture Breaks Ground on Dresden Fab
August 20, 2024 by
DRESDEN, Germany, August 20, 2024— ESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. “Together with our partners, Bosch, Infineon and NXP, we are […]
@HPCpodcast: US Pressures ASML on Exports to China; US vs China Exascale; HPC Software
July 18, 2022 by
Following recent reports that Dutch chip manufacturing equipment maker ASML is under diplomatic pressure from the U.S. to regulate the export of its fabrication equipment to China, we discuss market data, other suppliers of fab equipment, and a quick view of some of ASML’s own suppliers. ASML, the world’s only maker of extreme ultraviolet lithography systems, does not export to China EUV equipment instrumental to making the world’s most advanced chips used in HPC systems; it is the company’s older equipment, DUV (deep ultraviolet lithography) systems, that the US is trying to block from the China market.
