TSMC Joint Venture Breaks Ground on Dresden Fab

DRESDEN, Germany, August 20, 2024—  ESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. “Together with our partners, Bosch, Infineon and NXP, we are […]