A good mid-October morn to you! Here’s a brief (6:30) run-through of developments from the world of HPC-AI, including: AMD’s products rollout, Foxconn’s big Blackwell AI HPC in Taiwan, AI for science drives Nobel Prizes, Meta AI guru’s AGI skepticism
HPC News Bytes 20241014: AMD Rollout, Foxconn’s Massive AI HPC, AI Drives Nobels, Are LLM’s Intelligent?
October 14, 2024 by
AMD Launches CPU, GPU and DPU Chips Aimed at Big AI
October 10, 2024 by
Today in San Francisco AMD announced updated versions of its chips portfolio and moved to position itself as an across-the-board provider of data center technology for organizations implementing Big AI. The company also said it is speeding up its product release cadence, a move clearly aimed at ….
Supermicro Introduces 3U Server for Edge AI
October 8, 2024 by
San Jose, October 8, 2024 – Supermicro announced a high-density infrastructure platform optimized for AI inferencing at the network edge. Supermicro’s system delivers up to 10 double-width GPUs in a single system capable of running in traditional air-cooled environments, according to the company. The SYS-322GB-NR includes two powerful Intel Xeon 6900 processors with P-cores, 8800 MT/s […]
HPC News Bytes 20241007: Staggering Data Center Energy Costs, Optical Computing Update, AI at Decade’s End
October 7, 2024 by
Good October morning to you! We kick off HPC News Bytes for the month with a raft of developments in the world of HPC-AI, including: A new report on staggering data center energy costs, NTT on positive developments in optical computing and networking ….
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
October 4, 2024 by
TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage […]
Nvidia H100s GPUs Available on IBM Cloud for AI and HPC
October 1, 2024 by
Oct. 1, 2024 — IBM announced the availability of NVIDIA H100 Tensor Core GPU instances on IBM Cloud. It joins IBM Cloud’s existing lineup of accelerated computing offerings for enterprise’s AI implementation. IBM said that despite increasing interest in generative AI, only 39 percent of organizations surveyed say they are currently implementing or operating gen AI […]
HPC News Bytes 20240930: New Intel and AMD Chips, Advanced Chip Subsidies and a Quantum Update
September 30, 2024 by
A happy final day of September to you! Chips news dominated most of the developments coming out of the world of HPC-AI, including: Intel Xeon 6, Gaudi 3, MRDIMM, AMX; Intel 3 Fab, TSMC, Samsung, Chip subsidies; AMD Turin ….
Oracle Cloud Supercluster Supports 16,000 AMD Instinct MI300X GPUs
September 26, 2024 by
AMD today announced that Oracle Cloud Infrastructure has chosen AMD Instinct MI300X GPUs with ROCm open software to power its newest OCI Compute Supercluster instance … For AI models comprised of hundreds of billions of parameters ….
Vultr Offers AMD Instinct MI300X for AI Cloud Platform
September 25, 2024 by
West Palm Beach, FL – Sept. 25, 2024 – Cloud computing platform Vultr today announced that the new AMD Instinct MI300X accelerator and ROCm open software are set to be made available within Vultr’s composable cloud infrastructure. The collaboration between Vultr’s composable cloud infrastructure and AMD next-generation silicon architecture is designed to unlock “new frontiers […]
Intel Unveils Next-Gen Xeon 6 and Gaudi 3 Aimed at AI
September 24, 2024 by
Amid swirling reports of a multi-billion capital infusion offer from an investment firm along with a reported acquisition attempt, Intel proceeded today with launches of the Xeon 6 CPU and the Gaudi 3 AI GPU, both chips aimed at exploding demand for AI compute — and at competitors Nvidia and AMD. Intel said the Xeon 6 (“Granite Rapids”) with Performance-cores (P-cores) delivers twice the performance of its predecessor and features increased core count, double the memory bandwidth ….
