MOUNTAIN VIEW, Calif., Nov. 14, 2024 — Photonic supercomputing company Lightmatter today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to […]

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[SPONSORED GUEST ARTICLE]  Scaling GenAI inference performance requires increasing the number of GPUs or accelerators working in parallel within the scale-up domain. In-package optical I/O offers a path forward by breaking the ....

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[CONTRIBUTED THOUGHT PIECE]  .... large language models and generative AI applications are driving hyperscalers to adopt a new data center-scale switch fabric... And there is a new interconnect technology ....

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SANTA CLARA, Calif. – Jan. 11, 2024 – Ayar Labs, a company focused on silicon photonics for chip-to-chip connectivity, today announced two additions to its Board of Directors. Ganesh Moorthy, President and CEO of Microchip Technology Inc., and Craig Barratt, former CEO of Atheros and current Chair of the Board of Intuitive Surgical, will join the company’s […]

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[SPONSORED GUEST ARTICLE]  .... developments in photonics-based interconnects are so intriguing, offering the promise of increasing bandwidth by up to 1000x at 10%....

The post ‘Glow-in-the-Dark’ GPUs, Holes Burnt in Boards, Overprovisioning Systems ‘Until Funding Runs Out’ and Other Factors Calling for Optical I/O appeared first on High-Performance Computing News Analysis | insideHPC.

Along with his article to be found on this site, technology analyst Adrian Cockcroft of OrionX (and former AWS vice president) joins Shahin and Doug after SC23 to discuss TOP500 trends, the AI-HPC crossover, liquid cooling, chiplets, and the emergence of UCIe and CXL – some of the anticipated advancements are truly eye-popping. In this podcast, sponsored by Lenovo, the relentless pursuit of higher performance, the acceleration in the pace of change in high performance processing, is examined.

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By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same....

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BEAVERTON, OR. – August 2, 2023 – PCI-SIG today announced the formation of a workgroup to deliver PCI Express (PCIe) technology over optical connections. The PCI-SIG Optical Workgroup intends to be optical technology-agnostic, supporting a range of optical technologies, while potentially developing technology-specific form factors. “Optical connections will be an important advancement for PCIe architecture as they will […]

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Silicon photonics has the potential to transform HPC: it’s a dual-threat interconnect technology that could – if and when it is wrestled into commercial, cost-effective form – move data within chips and systems much faster than conventional, copper-based interconnects while also delivering far greater energy efficiency. Venture-backed start-ups and established tech companies....

The post @HPCpodcast: Silicon Photonics – Columbia Prof. Keren Bergman on the Why, How and When of a Technology that Could Transform HPC appeared first on High-Performance Computing News Analysis | insideHPC.

TROY, Mich., December 20, 2022 – Altair (Nasdaq: ALTR) has invested $10 million in Xscape Photonics, a start-up that developed patented technology for photonic chips for ultrahigh-bandwidth connections inside data centers and high-performance computing (HPC) systems (see related story). In its announcement, Altair said, “Until now, computing leveraged a traditional electronic approach to moving vast […]

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