At its Foundry Forum today in San Jose, Samsung Electronics spotlighted its foundry business strategy with emphasis on high performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications. A featured announcement: Samsung committed to bringing 1.4-nanometer (nm), for production in 2027. That will be preceded by the introduction of 2nm process in 2025 […]
TSMC, Samsung to Hike Chip Prices
May 17, 2022 by
The HPC sector – in which systems utilize hundreds, thousands, even tens of thousands of chips – is chip-price sensitive. Now comes news that two of the world’s most advanced chip manufacturers, Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung, are warning customers they plan to raise prices significantly. Due to global inflation, rising electricity and […]
Samsung and Western Digital Form Zoned (Block) Storage Collaboration
March 29, 2022 by
Samsung Electronics and Western Digital today announced a collaboration around zoned storage, which is a form of block storage, focused on data placement, processing and fabrics (D2PF) technologies. Western Digital has said zone storage is designed for workloads with increasingly voluminous and complex data management needs, creating “block storage devices that have their address space […]
Samsung Announces PCIe 5.0 SSD for Enterprise Servers
December 23, 2021 by
SEOUL – Dec. 23, 2021 – Samsung Electronics Co., Ltd. today announced the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND. “For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and reliability by leading […]
IBM and Samsung Unveil ‘Semiconductor Breakthrough That Defies Conventional Design’
December 14, 2021 by
Today, IBM and Samsung Electronics jointly announced what they said is a breakthrough in semiconductor design utilizing a new transistor architecture that allows more transistors to be packed in an IC chip. The key: the transistors stand up rather than lie down, thus taking up less space and offering “a pathway to the continuation of […]
Inspur and Samsung Announce Joint Open Storage Solution for OCP
November 9, 2021 by
SAN JOSE, November 9, 2021 – At this week’s OCP Global Summit in San Jose Inspur and Samsung will jointly launch the Poseidon V2 E3.x reference system. This product adopted composable architecture to maximize the benefits of EDSFF E3.x form factor. The Poseidon V2 system can accommodate not only the PCIe Gen5 SSDs but also various […]
Samsung Claims First Open-source Software for CXL Memory Platform
October 7, 2021 by
Samsung today introduced what it said is the first open-source software solution designed for the Compute Express Link (CXL) memory platform. The company said the Scalable Memory Development Kit (SMDK) builds on Samsung’s May launch of a CXL memory expander, designed to allow memory capacity and bandwidth to scale to levels exceeding server system limits. […]
Samsung: First HKMG-Based 512GB DDR5 Memory Targets Bandwidth-Intensive Applications
March 24, 2021 by
Samsung today announced it has expanded its DDR5 DRAM memory portfolio with what the company said is the first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology, designed to support next-gen computing systems, supercomputers and large-scale data centers “Delivering more than twice the performance of DDR4 at up to 7,200 megabits per second […]
Roll Over von Neumann? Samsung Claims Progress on the Compute-Memory Divide for HPC, AI
February 18, 2021 by
Samsung is claiming progress on the ages-old compute-memory bottleneck inherent in the classical von Neumann computing architecture. The company has announced what it said is the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The company said the processing-in-memory (PIM) architecture brings AI computing capabilities inside high-performance […]
