A happy final day of September to you! Chips news dominated most of the developments coming out of the world of HPC-AI, including: Intel Xeon 6, Gaudi 3, MRDIMM, AMX; Intel 3 Fab, TSMC, Samsung, Chip subsidies; AMD Turin ....

The post HPC News Bytes 20240930: New Intel and AMD Chips, Advanced Chip Subsidies and a Quantum Update appeared first on High-Performance Computing News Analysis | insideHPC.

SEOUL, July 9, 2024 – Altair (Nasdaq: ALTR), a global leader in computational intelligence, has been selected as an electronic design automation (EDA) partner for the Samsung Advanced Foundry Ecosystem (SAFE). Through this collaboration, Altair and Samsung Electronics will combine Altair’s comprehensive EDA technology with Samsung Foundry’s manufacturing capabilities to establish a more innovative, more efficient semiconductor design and production process. […]

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Good first-Monday-of-summer morning to you! Here’s a rapid (6:35) run-though recent HPC-AI news: GPU price war in the offing?; rectangular chip wafer design ....

The post HPC News Bytes 20240624: GPU Price War?, Rectangular Chip Packaging, AI for Science Assistant, Big HPC-AI Systems Keep Coming appeared first on High-Performance Computing News Analysis | insideHPC.

MOUNTAIN VIEW, Calif. – March 26, 2024 – HPC and AI interconnect company XConn Technologies today announced the release of early production samples for its “Apollo” CXL 2.0 switch, which the company will demonstrate with Samsung during MemCon 2024, March 26-27, in Mountain View, Calif. The XConn Apollo switch is the industry’s first and only hybrid […]

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A happy end-of-March morning to you! Here’s a rapid (5:57) run-though of the latest news in HPC-AI, including: final reflections on Nvidia GTC 2024, Intel to receive $8.5 billion via US CHIPS Act, the expanding Ultra Ethernet Consortium, Samsung’s upcoming GPU/HBM blend.

The post HPC News Bytes 20240325: Final GTC Thoughts, Intel and CHIPS Act Largesse, Ultra Ethernet Consortium Expands, Samsung’s GPU/HBM Chip appeared first on High-Performance Computing News Analysis | insideHPC.

Start up robotics company Figure, founded in 2022 and based in Sunnyvale, CA, is in the process of attracting $675 million in venture funding from the likes of Amazon founder Jeff Bezos, Microsoft, Intel, Samsung, OpenAI and Nvidia, along with a slew....

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SAN JOSE, Feb 20, 2024 – Samsung Electronics Co., Ltd. today announced a collaboration to deliver Arm Cortex-X CPU developed on Samsung Foundry’s Gate-All-Around (GAA) process technology. This initiative is built on a partnership with devices shipped with Arm CPU intellectual property on various process nodes offered by Samsung Foundry. This collaboration will lead to […]

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A happy mid-October morning to you! Today’s HPC News Bytes podcast offers a rapid (5:08) romp through recent HPC developments, including: China's goal of 300 exaflops in 2025; Samsung's 3nm chip win; Exascale Day; fewer women computer scientists since 1984; the GPU competition between NVIDIA, AMD and Intel....

The post HPC News Bytes 20231016: China and 300eFLOPS, Samsung’s 3nm Order, Exascale Day, Women and Coding, the Coming GPU Battle appeared first on High-Performance Computing News Analysis | insideHPC.

Beaverton, Oregon — The OpenMP Architecture Review Board (ARB) today announced that Samsung has joined the board. The OpenMP ARB is a group of hardware and software vendors and research organizations creating the standard for shared-memory parallel programming model in use today. Samsung Electronics is a world-leading semiconductor manufacturer with a range of products that […]

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SEOUL – December 21, 2022 – Samsung Electronics Co., Ltd. today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD. Leveraging the latest DDR5 standard, Samsung said its 12nm-class DRAM will help unlock speeds […]

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