A happy Thanksgiving week to you Americans and a happy last week of November to the rest of the world. Here’s a rapid (6:43) run-through of recent news and trends from the world of HPC-AI, including: SC24 in Atlanta ….
HPC News Bytes 20241125: SC24 Hit Show in Atlanta, Hyperion’s Booming Market Update, Report: TSMC Tech in Huawei AI Chips
HPC News Bytes 20241118: On the Scene at SC24, TSMC and the CHIPS Act, Cerebras at Sandia
Good morning to you from SC24 in Atlanta. Here’s a quick (5:33) run-through of recent developments in the world of HPC-AI, including: The SC24 conference starts today; TSMC, the CHIPS Act and semiconductor demand; Sandia National Labs teams with Cerebras.
HPC News Bytes 20241111: TSMC 2nm Restrictions, AMD-Fujitsu Team on Arm, AMD Passes Intel, US Data Center Green Energy Uptake
With a salute to our service men and women on this Veteran’s Day, here’s a rapid (6:07) review of recent news ….
TSMC Reports October Monthly Revenue Jump of 29.2% YoY
HSINCHU, Taiwan, R.O.C. – Nov. 8, 2024 – TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for October 2024: On a consolidated basis, revenue for October 2024 was approximately NT$314.24 billion, an increase of 24.8 percent from September 2024 and an increase of 29.2 percent from October 2023. Revenue for January through October […]
HPC News Bytes 20241028: US Chip Fab Beats Taiwan, Tech and Danish Royalty Unveil AI Supercomputer, White Houe Initiative on AI National Security Risk
Good Halloween Week to you! From the always-active world of HPC-AI here’s a quick ….
TSMC in Arizona Announces Higher Yields than Fabs in Taiwan
…. the news from Rick Cassidy, president of TSMC in the U.S., reported by Bloomberg, that the company’s Pheonix fab delivered 4 percent better yield on advanced chips than fab sites in Taiwan is impressive. In chip industry parlance, yield ….
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage […]
HPC News Bytes 20240930: New Intel and AMD Chips, Advanced Chip Subsidies and a Quantum Update
A happy final day of September to you! Chips news dominated most of the developments coming out of the world of HPC-AI, including: Intel Xeon 6, Gaudi 3, MRDIMM, AMX; Intel 3 Fab, TSMC, Samsung, Chip subsidies; AMD Turin ….
HPC News Bytes Podcast 20240909: AI vs. Copyright, TSMC’s CoWoS Capacity, Intel’s 18A Fab, an RFP for the Future of HPC
Good late summer morning to you! From the world of HPC-AI we offer a quick (6:10) recap of recent news developments, including: DOE’s $23M future of HPC RFP ….
TSMC Joint Venture Breaks Ground on Dresden Fab
DRESDEN, Germany, August 20, 2024— ESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. “Together with our partners, Bosch, Infineon and NXP, we are […]